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Higher Aspect Ratio TSV Structure ECP Bottom-Up Plating...

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Higher Aspect Ratio TSV Structure ECP...

Higher Aspect Ratio TSV Structure ECP Bottom-Up Plating Process

Yinuo Jin & Bo Zheng & Jian Wang & David H. Wang & Qixing Yu

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2021 22nd International Conference on Electronic Packaging Technology (ICEPT);2021; ; ;10.1109/ICEPT52650.2021.9567719

Casa editrice:

IEEE

Lingua:

english

ISBN 10:

1665413913

ISBN 13:

9781665413916

ISBN:

10.1109/ICEPT52650.2021.9567719

File:

PDF, 17.08 MB

IPFS:

,

english0

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